• MX 3012
  One point manual wafer thickness gauge
  
  
• MX 1012
  High resolution (10nm) Thickness & TTV gauge for 12” & 8” Si wafers. Yields four or eight symmetric diametral cross-cut views. Automatic recalibration before each wafer. Large selectable thickness range 200-950µm, +/- 0.3µm thickness accuracy and +/- 50nm TTV accuracy. Throughput: 12” wafer, 8 scans < 60secs. Manual wafer loading.
  
  
• MX 2012-69-R
  Manual or Automatic wafer loading Contactless Geometry Gauge for 300mm wafers. Measures Thickness, TTV, Bow, Warp, Flatness, TIR, SORI and Shape
  
  
• MX 2013-37-R
  Manual or Automatic wafer loading Contactless Geometry Gauge for THIN 300mm wafers. Backside grinding measurement applications, up to 6000µm warp measurements

• MX 6012
  Contactless 300mm wafer gauge for resistivity, thickness and P/N type.

• MX 2012-6012
  Automated high throughput robotic wafer sorter for 300mm geometry, resistivity and type measurements.

• MX 7012
  High rsolution thickness and surface profiler for as-cut 300mm wafers.

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E+H also offers a unique line of wafer gauges for backside grinding measurements as well as several standard wafer characterization tools.