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- MX 203-6-33-B
Manually loaded
warp and thickness gauge
100 mm, 125 mm and 150 mm wafers
- MX 203-8-37-B
Manually loaded
warp and thickness gauge
150 mm and 200 mm wafers
- MX 203-8-49-B
Manually loaded
warp and thickness gauge
100 mm, 125 mm, 150 mm and 200 mm wafers
- MX 202-1-G-1
Cassette-to-cassette
warp and thickness gauge Transport belts, one input module, one
output module. 100 mm and 150 mm wafers
- MX 202-2-G8-1
Go/no go warp
and thickness sorter. Transport belts, one input module, two output
modules
150 mm and 200 mm wafers
- MX 203-58-37-B
Manually loaded
warp and thickness gauge
125 mm, 150 mm and 200 mm wafers
- MX 204-8-21-VR
Automatic warp
and thickness gauge. Robot, motor-driven wafer tray, vacuum chuck.
150 mm and 200 mm wafers
- MX 2013-37-R; MX 2013-37
Automatic or
manual load warp and thickness gauge. Robot, vacuum chuck, motor-driven
wafer tray. 200 and 300 mm wafers
- MX 202-1-GW-1
Cassette-to-cassette
warp and thickness gauge. Separate thickness and warp probe heads,
vacuum chuck. Transport belts, one input module, one output module.
150 mm wafers
- MX 204-6-13-V
Manually loaded
warp and thickness gauge. Motor-driven wafer tray, vacuum chuck.
100 mm, 125 mm and 150 mm wafers
- MX 204-8-21-V
Manually loaded
warp and thickness gauge. Motor-driven wafer tray, vacuum chuck.
150 mm and 200 mm wafers
.
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| Maximum
warp allowed: 700 µm |
|
| Maximum
warp allowed: 800 µm |
|
| Maximum
warp allowed: 1000 µm |
|
| Maximum
warp allowed: 1100 µm |
|
| Maximum
warp allowed: 1600 µm |
|
| Maximum
warp allowed: 1600 µm |
|
| Maximum
warp allowed: 2000 µm |
|
| Maximum
warp allowed: 6000 µm |
|
| Maximum
warp allowed: 2500 µm |
|
| Maximum
warp allowed: 3000 µm |
|
| Maximum warp allowed: 3000 µm |
|
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Note:
Specifcation of maximum warp allowed refers to largest wafer diameter |
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