• MX 203
  Contactless Wafer Geometry Gauges for Thickness, TTV, Bow, Warp, Shape, FPD, TIR, Sori measurements.

  o MX 203-4-21 for 2", 3", and 4" wafers

  o MX 203-6-33 for 4", 5" and 6" wafers

  o MX 203-8-37 for 6" and 8" wafers

  o Less than 5 second measurement time

o Stress measurements

• MX 302 SERIES
  High resolution wafer thickness and thickness variation gauge for 150mm and 200mm wafers. 10 nanometer resolution.

• MX 202 SERIES
  Automated Cassette-to-Cassette wafer sorters with multiple bin sorting. Up to 4 cassettes in and 24 cassettes out! Individual measurement stations for Geometry, Flatness & Resistivity.

• MX 1012, 102-8 & MX 102-6
  High resolution (10nm) thickness & TTV gauges for 12" & 8", 6" & 8" and 4",5",6" Si wafers. Yields 4 or 8 symmetric diametral crosscut views. Automatic recalibration before each wafer. Large selectable thickness range 200-950µm, +/- 0.3µm thickness accuracy and +/-50nm TTV accuracy. Throughput: 12" wafer, 8 scans <60 secs.

• MX 301-AZ & MX 301-8
  The MX 301-AZ is a single cassette, automatic system for the measurement of center thickness of 4"- 8" Si wafers. Featuring 10nm resolution with an overall accuracy of 0.25µm, high temperature stability and self-recalibration. The MX 301-8 is a manually operated thickness gauge for Si wafers up to 8" diameter.

• MX 608-8-R
  Contactless resistivity and radial resistivity variation gauge with or without robot loading, 150mm and 200mm wafers. Thickness accuracy: +/- 0.3µm, resistivity accuracy: +/- 0.5%.

• MX 604
  Handheld resistivity gauge for silicon blocks. 0.25 - 25 ohm-cm range, 3% accuracy.

• MX 601
  Contactless semi-insulating wafer resistivity gauge with automatic temperature compensation. Measurement range between 2E6 - 2E9 ohm-cm

• MX 605-8
  Multi-point type tester for silicon wafers

Downloadable product information:

E+H also offers a unique line of wafer gauges for backside grinding measurements as well as several 300mm wafer characterization tools.