WEG Wafer Edge Inspection Systems by NED
Description
Wafer Edge Defect Detection

Overview
The WEG detects wafer-edge defects using a proprietary multi-camera system, including high-resolution line scan cameras developed by NED for this special application.
Detected defects include cracks, chips, pits and scratches on the wafer edge and on the notch.
The user can easily set the detection parameters and based on these criteria the system will automatically judge the wafer quality, and will store and display the defect data.
DUAL FOUP 300mm SYSTEM
INSPECTION STATION

Features

  • High Contrast Microscopic Image of Wafer captured by High Resolution Line Scan Camera with comprehensive Defect Data Storage
  • Defect Inspection and Classification using advanced Image Data Processing
  • Defect Detection Simulator Function using recorded image data
  • High Throughput using High-Speed Image Data Processing Technology
  • Excellent Detection Repeatability
Special Optical Methods to Illuminate the Wafer Edge

Key Elements

  • Imaging power is increased by using a special high resolution, high speed and wide dynamic range line CCD array
  • Powerful image processing software and hardware
  • Special optical methods of illuminating the wafer edge
  • No Laser is used
  • Large database of different types of defects
  • Highly repeatable inspection results due to the use of a low noise, wide dynamic range and high resolution line sensor array
  • Simulation function available that uses the saved whole edge image

The wafer edge image is captured by three cameras from three different directions (upper, side, and lower).
The CCD layout is shown in the illustration figure below.
The notch area is captured by five cameras from five different directions.

Powerful Image Processing Software and Hardware
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