MX 102-6, MX 102-8
High Resolution Wafer Thickness and Thickness Variation Gauge
System Description
The MX 102-6 and MX 102-8 are instruments for the measurement of center thickness and thickness variations of 1OOmm to 150mm and 150mm to 200mm silicon wafers respectively. Each gauge has a resolution of 10nm and a thickness range of 300µm to 700µm for the MX 102-6 and 450µm to 850µm for the MX 102-8.

Before each wafer scan, the gauge automaticaly re-calibrates itself by means of a standard thickness gauge block. A pair of capacitive sensors samples four radial profiles of each wafer, each profile measurement points offset by 45° from the previous profile. A host computer interfaces with the gauges and records and stores all measurement data.

Specifications
Resolution
Spatial Resolution
Precision (Repeatability), (wafer still, one measuring point)
TTV - Accuracy ± 50 nm
Thickness ranges (MX102-6)
Thickness ranges (MX102-8)

10 nm
1 mm
± 20nm (2)
350, 450, 550, 650 µm, ± 50 nm each
500, 600, 700, 800 µm, ± 50 nm each


Fig. 1
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Fig. 2
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Fig. 3
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Fig. 4
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Fig. 5
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Fig. 6
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Figures 1 and 2 show the mechanical structure of the system. Figures 3 and 4 show the four standard gauge blocks and the exchangeable shims. These shims are coded so the corresponding gauge block is automatically selected. Figures 5 and 6 represent hard copies made during two consecutive scans of the same wafer (demonstration of gauge repetability). The software permits the selection of different scales and offsets of the displayed measurement data.
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