The
MX 202 automatic wafer geometry and resistivity sorters measure wafer
thickness, global flatness, warp and resistivity. Their high throughput
and reliability make them an excellent choice for geometry and resistivity
sorting in various stages of wafer production and processing: sawing,
grinding, lapping, polishing and IC production.
- Thickness: Center,
Average, Maximum, Minimum, Total Thickness Variation
- Global Flatness:
Max Positive and Max Negative Focal Plane Deviation (FPD), Total Indicator
Reading (TIR)
- Warp: Bow-bf, Max
Negative, Max Positive, Total, Shape
- Resistivity: Center,
R/2, Gradient
Numerous sorter configurations with a multitude of input and output cassettes offer high throughput:
Small Diameter 100mm
- 150mm: 700 wafers per hour
Large Diameter 150mm - 200mm: 500 wafers per hour
The input/output modules
are self contained units with an independent stepper motor, twin parallel
polyurethane transport belts, and "wafer in place" detection
sensors. Each module is individually controlled by a central processor.