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Defect Detection for Ultra-Flat Wafers  
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THE MAGIC MIRROR INSPECTION METHOD

The Magic Mirror or Ma-kyoh (meaning 'magic mirror' in Japanese) refers to a bronze mirror originating from ancient China that reflects an image to a distant wall when the Sun shines on the mirror. A relief pattern, resembling the projected image,is engraved on the back side of the mirror; no pattern can be seen on the front side by the naked eye.

The 'magic' of the mirror can be understood using simple geometrical principles: the local irregularities of the reflecting surfaceact as concave or convex mirrors therefore a collimated light beam impinging on the surface produces an image on a screen that, to a certain extent,reflects the mirror's morphology. The front-face microdeformations (invisible to the naked eye) are caused by the stresses due to the engraved back image.

The Makyoh concept is a powerful topographic tool for the characterization of the morphology of glass and mirror-like surfaces, such as semiconductor wafers. The sensitivity of the method is a 0.4 μm height difference over a 10 mm distance and 50 nm over a 0.5 mm distance. Makyoh topography has proven its power,for example in detecting flaws induced by wafer slicing,polishing and lapping and defects in directly bonded Si wafers.

Magic Mirror image of 200mm polished wafer with grinding marks

Presentation (PDF)

Article: Fine grinding of silicon wafers: a mathematical model for grinding marks (PDF)

Article: Geometrical optical model of the image formation in Makyoh (magic-mirror) topography (PDF)

Sample Magic Mirror Images Backside Grinding (PDF)