Measurement Capabilities: User programmable PBS® and EPBS™ subsurface defect measurements with step sizes down to 10µm, a defect orientation map (V-MAP) can be made at any place on the test surface, full manual or automatic control of the measurement process is possible.

Measurement Speed: Variable, depending on measured area and step size. Typically 20 minutes for a 200mm full wafer map.

Minimum Detectable Level: 0.001 ppm/Sr scattered light.

Defect Detection Depth: 3µm for Si and =0.4µm for GaAs at 632.8nm wavelength †

Computer System: PC compatible computer with an Intel processor running the PBS® Instrument Control Software under Windows 95. †

Probe Beam: Helium neon laser at 632.8nm, 0.30mm diameter spot size, 25mw on test surface. †

Data Display: 17" color monitor with 1280 x 1024 resolution and 65,000 colors. †

Physical Size: Measurement unit -1905mm (75") high x 1651mm (65") wide x 915mm (36") deep; separate workstation for the monitor, keyboard & mouse.

Facility Requirements: 120 VAC, 15 Amp, 60 Hz electrical service, vacuum is required; measurement unit must be located in a cleanroom.

† Items indicated can be modified to meet customer requirements. Offered exclusively worldwide by Hologenix, contact us for further details. Specifications subject to change without notice. PBS ® and VTI ® are registered trademarks of VTI, Inc., EPBS ™ is a trademark of VTI, Inc.