| Magic
Mirror™ |
|
| 2
Cassette Automated Wafer Surface Inspection System |
|
|
|
|
|
|
|
|
 |
| YIS
200SP-2/APS2XT Features |
|
|
- Fully-Automatic
Defect Detection with Hologenix ADDS Image Processing Software
- Adjustable
Defect Detection Recipes
- Detection
Sensitivity better than 0.05 Micron Depth with <1M-100M Radius
of Curvature using Proprietary Magic Mirror™ Method
- Images can
be saved and/or printed
- 150mm - 200mm
wafer inspection
- 200 wafers
per hour throughput (200mm)
- Class 1 Clean
Room Compatible
- Windows NT
Environment
- Standalone
Sorter Capability
- Optional:
Fully Automatic Inspection
- Adjustable
sensitivity setting with digital display
- Adjustable
brightness setting with digital display for wafer reflectivity
|
|
| Optical
Resolution |
|
|
|
|
- Monochrome
800 x 600 low-light level CCD.
- Detection
sensitivity: < 0.05 micron depth, < 1 M - 100M radius of
curvature.
|
| Light
Source & Optics |
|
|
|
|
- Broad-beam
illumination with narrow band-pass filtered white lamp. Photo-diode
sensor and feedback circuit for continuous intensity output. Defocused
reflective imaging using the proprietary Magic Mirror™ method.
|
| Automation |
|
|
|
|
- Dual Cassette
and Dual Robots
- Dual cassette
wafer sorter with automated and semi-automated defect detection
software
- Non-Contact
Notch, Flat-Finding and Centering Technology
- Optional:
SECS II - GEM
|
| Hardware |
|
|
|
|
- IBM PC compatible
computer with Touchscreen monitor (Not Pictured)
- 32 BIT graphic
processor with Hologenix ADDS auto dimple detect/flaw-finder software
- Hi-Resolution
8 x 10" 255 gray-shade printer
- Color prints
& transparencies (optional)
|