Magic Mirror™
300MM 2 Cassette Automated Wafer Surface Inspection System
YIS-300SP-2
  • 200mm and/or 300mm compatible; 13 or 25 capacity
  • FOUP or open cassette
  • Class 0.1 mini-environment
  • OCR camera
  • Ion flow bar for ESD protection
  • Non-contact notch finder
  • Edge-grip wafer handling; Easy-to-use touchscreen operation
  • Signal tower
  • 150 wafers per hour
  • SECSII/GEM integration
  • Mini-environment monitoring/regulating system; Wafer-shipper FOUP compatibility
  • Carrier ID-tag integration
  • Fully automated system integrated under Windows NT 4.0 software
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