| Magic
Mirror™ |
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| 300MM
Manual Wafer Surface Inspection System |
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| YIS-300SP
Standard Features |
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- Manual loading,
rotating wafer chuck
- 150 - 300mm
wafer sizes
- Full wafer
view and 4x zoom for close-up (slip line) inspection
- Adjustable
sensitivity setting with digital display
- Adjustable
intensity (brightness) setting with digital display for wafer
reflectivity
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| Optical
Resolution |
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- Monochrome
800 x 600 low-light level CCD. Detection sensitivity: <0.05
micron depth, <1M-100M radius of curvature.
- <0.05
micron depth, <1 M - 100M radius of curvature.
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| Light
Source & Optics |
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- Broad-Beam
illumination with narrow band-pass filtered white lamp.
- Photo-diode
sensor and feedback circuit for continuous intensity output.
- Defocused
reflective imaging using the proprietary Magic Mirror™ method.
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| Software |
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- Semi-automated
image enhancement and analysis program with 25 function processor.
- Option -
High resolution printer w/255 grey shades or color 8" x 10"
thermal video prints.
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