Applications: Topography/ Bumps
a)
b)

2D height distribution of a microelectronics pad including rounded bumps
a) Height distribution of a microelectronic pad of 700 x 500 µm² size. The false-color bar exhibits the maximum height of the rounded bumps being around 90 µm.
b) Enlarged top surface of one bump. The colors represent the amount of reflected signal (red is plenty, blue is little).

3D topography from
squared mini bumps
Detail 3D topography of the surface of squared bumps at 15 µm height. The false colors exhibit the reflected signal (red is plenty, blue is little). Acquired with the complete system SemDex 310.


Corresponding 1D profile from 2 adjacent squared bumps.
CCD Camera option
The SemDex 310, 311 and 110 can be equipped with a CCD camera as option built into the corresponding sensor heads. The field-of-view is 1 mm2 at approx. 500 x 500 pixels.
Surface roughness profile of a mini bump
Roughness profile on top of a bump at 15 ìm height. The roughness was evaluated to be Rz = 44.8 nm (Ra = 13.2 nm). Acquired with the complete system SemDex 310.
Focussing is automatically performed. Software features permit the selection of points, lines or areas of interest to be inspected.
» Product Page: SemDex Series 300 and 100
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