Applications:
• (Substrate-) layer thickness
• Bow/ warp
• Flatness (SBIR)
• Topography (Mini-bumps)
• Roughness

SemDex 300 series

Depending on the application, various sensor heads are
integrated into the complete system. The high-end device
SemDex 311 permits the simultaneous evaluation of substrate
layer thickness from the inverted side and topographic
inspection (as mini-bumps) from the top side. All SemDex 300
devices can be combined with a fully automated wafer handling
system, while yet retaining the manual handling mode.
The internal wafer chuck can load wafer diameters of 6”, 8”
and 12” even with flip-frame carriers.

Features:
• Definition of the measurement coordinates with a
comfortable wizard
• Visual selection of points of interest via CCD camera option
• Detailed analysis of layers, bow/warp, flatness and display
• Display of topographic profiles (2D, 3D) and roughness evaluation
• CAD based measurement of deviations between measured and nominal value as option
• Data interface for import and export
• Documentation
• Acquired data are network compatible via LAN
• Easy to operate
Benefits:
• Contactless measurements at reflection mode
• Very high acquisition rates of up to 16 kHz and
150 nm repeatabilities
• Surface velocities from the wafer of up to 50 mm/sec
• High lateral resolution by small spot size (> 5 µm)
• Precise topography evaluation in spite of protecting
layers (polyimide)
• Surface topography, roughness, flatness, bow/warp
(and thin layers) in one scan available
• Steep slopes at bumps or trenches (sometimes > 60°)
• Negligible shadowing at very steep slopes
• Automatic beam refocussing at various working
heights (multiple chuck)
• No re-calibration of the system outside the factory

SemDex 100 series

Depending on the application, various sensor heads are integrated into the table-top system. With SemDex 101 substrate layer thickness can be evaluated while SemDex 110 permits topographic features (as mini-bumps) to be inspected. The
internal wafer chuck can load wafer diameters of 2” and 4”.

» Application 1: (Substrate-) Layers
» Application 2: Topography/ Bumps